In recent years there has been a sharp rise of multi-die system designs. Numerous publications targeting a large variety of applications exist in the public domain. One presentation [2] on the IEEE’s ...

Throughout the electronics industry, submicron feature size at the die level are driving package component sizes down to the design-rule level of the early technologies. Today’s integrated circuit (IC ...

For a company that delivers more than 13 million parcels and documents each day within a service area that includes some 200 countries and territories, any technology that improves package flow is ...